Intel's Exclusive Chip Packaging Technology EMIB Achieves Over 90% Yield, Attracting Orders from Google, NVIDIA, and Meta
Intel's stock has risen sharply recently, regaining a market capitalization of over $500 billion, more than quadrupling in a year. This surge is attributed not only to the re-evaluation of the AI value of its x86 CPU business but also to the steady improvement of Intel's chip technology. Intel reported exceeding expectations in the 18A process yield, reaching its target by the end of this year, with the 14A process showing surprisingly good results.
However, Intel's chip packaging technology, EMIB, is likely to attract customers. This is Intel's exclusive 2.5D packaging technology developed over many years, with two products available: EMIB-T and EMIB-M.
The latter incorporates a silicon bridge circuit with MIM capacitor design, which reduces noise and improves the integrity of power transmission signals. Although the cost is slightly higher, its better stability and lower leakage characteristics will attract high-end customers.
With EMIB packaging technology in hand, Intel is fully capable of taking a significant number of CoWoS packaging orders from TSMC, which is currently at full capacity and has high manufacturing prices, making it a critical bottleneck to some extent, even more so than advanced process manufacturing.
A report from Wall Street analyst Jeff Pu states that Intel's EMIB packaging technology has achieved a yield rate of over 90%, with project progress going smoothly, and is expected to provide significant support for Intel's foundry business.
Potential customers include Google's next-generation TPU and NVIDIA's next-generation GPU Feynman, both of which plan to adopt Intel's EMIB packaging. Meta will also be a major customer, but the cooperation will not materialize until 2028 with their CPUs.